Nick Lanzillo

Publications

• Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects

  • • Koichi Motoyama
    • Jaemyung Choi
    • et al.
  • 2024
  • IEDM 2024

• The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology

  • • Daniel Edelstein
    • Son Nguyen
    • et al.
  • 2024
  • IEDM 2024

• Monolithic Stacked FET with Stepped Channels for Future Logic Technologies

  • • Chen Zhang
    • Seungmin Song
    • et al.
  • 2024
  • IEDM 2024

• Backside power distribution for nanosheet technologies beyond 2nm

  • • Ruilong Xie
    • Wonhyuk Hong
    • et al.
  • 2024
  • VLSI Technology and Circuits 2024

• DTCO Guided Process Integration: Case Studies From FEOL & BEOL with BSPDN

  • • Minhaz Abedin
    • Shahrukh Khan
    • et al.
  • 2024
  • ASMC 2024

• Topological Semimetal Resistivity Scaling for Vertical Interconnect Applications

  • • Nick Lanzillo
    • Utkarsh Bajpai
    • et al.
  • 2024
  • Applied Physics Letters

• Applications of Topological Semimetals for Post-Cu Interconnects

  • • Ching-Tzu Chen
    • Hsin Lin
    • et al.
  • 2024
  • MRS Spring Meeting 2024

• A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects

  • • K. Motoyama
    • D. Metzler
    • et al.
  • 2023
  • IITC/MAM 2023

• Exploring Topological Semimetals for Highly Scaled Interconnects Beyond Copper

  • • Ching-Tzu Chen
    • Christian Lavoie
    • et al.
  • 2023
  • MRS Spring Meeting 2023

• Unconventional Resistivity Scaling in Topological Semimetal CoSi

  • • Hsin Lin
    • Shang-Wei Lien
    • et al.
  • 2023
  • MRS Spring Meeting 2023