Nick Lanzillo

Publications

• Backside power distribution for nanosheet technologies beyond 2nm

  • • Ruilong Xie
    • Wonhyuk Hong
    • et al.
  • 2024
  • VLSI Technology and Circuits 2024

• DTCO Guided Process Integration: Case Studies From FEOL & BEOL with BSPDN

  • • Minhaz Abedin
    • Shahrukh Khan
    • et al.
  • 2024
  • ASMC 2024

• Applications of Topological Semimetals for Post-Cu Interconnects

  • • Ching-Tzu Chen
    • Hsin Lin
    • et al.
  • 2024
  • MRS Spring Meeting 2024

• A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects

  • • K. Motoyama
    • D. Metzler
    • et al.
  • 2023
  • IITC/MAM 2023

• Exploring Topological Semimetals for Highly Scaled Interconnects Beyond Copper

  • • Ching-Tzu Chen
    • Christian Lavoie
    • et al.
  • 2023
  • MRS Spring Meeting 2023

• Unconventional Resistivity Scaling in Topological Semimetal CoSi

  • • Hsin Lin
    • Shang-Wei Lien
    • et al.
  • 2023
  • MRS Spring Meeting 2023

• Thermal and Electrical Conductivity of Copper-Graphene Heterosystem: An Effect of Strain and Thickness

  • • Aiswarya Samal
    • Anoop Kumar Kushwaha
    • et al.
  • 2023
  • Advanced Engineering Materials

• A Multiscale Simulation Study of the Structural Integrity of Damascene Interconnects in Advanced Technology Nodes

  • • Sagarika Mukesh
    • Nicholas A. Lanzillo
  • 2023
  • IEEE T-ED

• Unconventional resistivity scaling in topological semimetal CoSi

  • • Hsin Lin
    • Shang-Wei Lien
    • et al.
  • 2023
  • APS March Meeting 2023

• Exploring Unconventional Resistivity Scaling in Topological Semimetals for Interconnects Beyond Copper

  • • Ching-Tzu Chen
    • Christian Lavoie
    • et al.
  • 2023
  • APS March Meeting 2023