What’s Next in Semiconductors
is powering full-stack AI
The way the world computes is shifting. Over the last decade, demand for AI applications has grown exponentially. Pipelines are getting more complex, and the world needs new hardware to train and serve AI at the scale enterprise demands. At IBM Research, we’re building the hardware and the tools to serve cutting-edge AI. We’re pushing the limits of semiconductor design, packaging, and connectivity, with innovations like sub-2 nm node chips, co-packaged optics, the AIU family of chips, and 3D nanosheet transistor technology. We’re building tomorrow’s AI supercomputers from the ground up.
Our work
- Q & APeter Hess
How AI is improving chip production
ExplainerPeter HessReimagining storage for the generative AI era
ResearchTalia Gershon, Mike Murphy, Swaminathan Sundararaman, Haris Pozidis, and Khanh NgoHow IBM Research helped prepare the IBM z17 for tomorrow’s workloads
NewsPeter HessWhy a decades old architecture decision is impeding the power of AI computing
ExplainerPeter HessThe 2024 IBM Research annual letter
Deep DiveSriram Raghavan, Mukesh Khare, and Jay Gambetta- See more of our work on Semiconductors
AI Hardware Center
The IBM Research AI Hardware Center is a global research collaboration hub dedicated to creating the next generation of systems and chips for AI workloads, as well as expanding joint research efforts across technology, architecture, and algorithms.
Publication collections
DAC 2025
10
ACM/IEEE Design Automation Conference
22 JunIEEE Symposium on VLSI Technology and Circuits
08 JunIEEE Electronic Components and Technology Conference
27 MayIEEE International Symposium on High Performance Computer Architecture
01 Mar