Design and Enablement on Cloud
Enabling partners to boost productivity and reduce costs in electronic design environments.
Overview
Since IBM created electronic design automation (EDA) in the 1950s, we have continued to advance our design infrastructure, including AI-infused EDA workflows. Today, IBM leverages this expertise to help EDA companies provide their offerings to clients as a service.
By boosting EDA productivity in the cloud, our goal is to accelerate the time to market of leading-edge technologies. Clients can leverage IBM assets such as LSF and Spectrum Scale on hybrid cloud architectures, providing solutions for fabless companies and semiconductor foundries to run their workloads in the cloud. This approach reduces costs by optimizing EDA tool use and efficiently sharing IT resources both in the cloud and on premise.
Additionally, our custom design partners can leverage IBM’s wealth of world-class research and expertise in system architecture, industry leading I/O and high-speed interconnects, processor and AI chip design, memory design, and the co-design of software and hardware to deliver state of the art solutions.
Our work
Why we need EUV lithography for the future of chips
ExplainerMike MurphyIBM Research unveils hybrid bonding for packaging chips
NewsMike MurphyThe path to 1 nanometer chips and beyond
ResearchMike MurphyThe future of computer chips is being built in Albany
Deep DiveMike Murphy
Publications
- Alper Buyuktosunoglu
- David Trilla Rodriguez
- 2024
- ISCA 2024
- Wachirawit Ponghiran
- Jinwook Jung
- 2024
- VLSI Technology and Circuits 2024
- Elron Bandel
- Yotam Perlitz
- et al.
- 2024
- NAACL 2024
- Milnes David
- Felipe Valenzuela
- et al.
- 2024
- ITherm 2024
- Maddalena Torricelli
- Mauro Martino
- et al.
- 2024
- WebSci 2024
- Justin Weisz
- Jessica He
- et al.
- 2024
- CHI 2024