Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- Koichi Motoyama
- Jaemyung Choi
- et al.
- 2024
- IEDM 2024
Dr. Huai Huang received his Ph.D. degree in physics from the University of Texas at Austin (Austin, TX, USA) and joined IBM in 2012 at the Albany Nanotech Center (now IBM Semiconductor Technology Research and Development devision ). Dr. Huang's research focuses on semiconductor interconnect technology, including reliability, integration and unit process. He has published two book chapters, more than 40 journal and conference papers. Those publications were cited over 1000 times from more than 20 countries in the world. He also holds over 40 issued US patents and serves as a reviewer for several high-impact-factor journals.