Capacitive Impacts of Etch-Induced Dielectric Damage in Highly-Scaled Interconnect Architectures
- Janet M. Wilson
- Nicholas A. Lanzillo
- 2022
- IITC 2022
Nick Lanzillo
Title
Research Staff Member
Bio
Nick earned a B.S. in physics from Syracuse University and a Ph.D. in physics from Rensselaer Polytechnic Institute (RPI) in Troy, NY. He joined IBM in 2016 as part of the back-end-of-line (BEOL) integration team and currently works on leading edge technology development with a focus on design-technology co-optimization (DTCO.) Nick was named an IBM Master Inventor in 2020 and again in 2023. He currently serves on the committee for the IEEE International Interconnect Technology Conference.
Publications
Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects
- Koichi Motoyama
- Nicholas A. Lanzillo
- et al.
- 2022
- IITC 2022
Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
- Takeshi Nogami
- Oleg Gluschenkov
- et al.
- 2022
- VLSI Technology and Circuits 2022
Evaluating the Potential of Weyl Semimetals as Future Interconnect Metals
- Sushant Kumar
- Yi-Hsin Tu
- et al.
- 2022
- MRS Spring Meeting 2022
Area-Selective Deposition of Tantalum Nitride with Polymerizable Monolayers: From Liquid to Vapor Phase Inhibitors
- Krystelle Lionti
- Noel Arellano
- et al.
- 2022
- Chemistry of Materials
Resistivity scaling in topological semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2022
- APS March Meeting 2022
Benchmarking Power Delivery Network Designs at the 5-nm Technology Node
- Nicholas A. Lanzillo
- Albert M. Chu
- et al.
- 2021
- IEEE T-ED
Power Delivery Design, Signal Routing, and Performance of On-Chip Cobalt Interconnects in Advanced Technology Nodes
- Nicholas A. Lanzillo
- Albert Chu
- et al.
- 2021
- IEEE Transactions on VLSI Systems
Electromigration and Line R of Graphene Capped Cu Dual Damascene Interconnect
- T. Nogami
- S. Nguyen
- et al.
- 2021
- IEDM 2021
Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- P. Bhosale
- N. Lanzillo
- et al.
- 2021
- VLSI Technology 2021
Patents
- US
- 11223655
- US
- 11217481
- US
- 11195792
- US
- 11195993
- US
- 11195795
- US
- 11189568
- US
- 11177162
- US
- 11177170
- US
- 11177166
- US
- 11171084
Top collaborators
DD
Dan J. Dechene
Director, Semiconductor Enablement
HB
Huiming Bu
Vice President: IBM Semiconductors Global R&D and Albany Operations
TY
Tenko Yamashita
Senior Manager - Advanced Logic Pathfinding Technology
HH
Huai Huang
BEOL Reliability, Quality and Characterization