Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node
- Benjamin D. Briggs
- C.B. Peethala
- et al.
- 2017
- IEDM 2017
Bio
Nick earned a B.S. in physics from Syracuse University and a Ph.D. in physics from Rensselaer Polytechnic Institute (RPI) in Troy, NY. He joined IBM in 2016 as part of the back-end-of-line (BEOL) integration team and currently works on leading edge technology development with a focus on design-technology co-optimization (DTCO.) Nick was named an IBM Master Inventor in 2020 and again in 2023. He currently serves on the committee for the IEEE International Interconnect Technology Conference.
Publications
First-Principles Investigations of TiGe/Ge Interface and Recipes to Reduce the Contact Resistance
- H. Dixit
- Chengyu Niu
- et al.
- 2017
- IEEE T-ED
Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node
- Takeshi Nogami
- X. Zhang
- et al.
- 2017
- VLSI Technology 2017
Electronic and structural analysis of ultra-small-diameter metal disilicide nanowires
- Nicholas A. Lanzillo
- T. Standaert
- et al.
- 2017
- Journal of Applied Physics
Ab Initio evaluation of electron transport properties of Pt, Rh, Ir, and Pd nanowires for advanced interconnect applications
- 2017
- Journal of Applied Physics
Near-surface controls on the composition of growing crystals: Car-Parrinello molecular dynamics (CPMD) simulations of Ti energetics and diffusion in alpha quartz
- Nicholas A. Lanzillo
- E.B. Watson
- et al.
- 2014
- Geochimica et Cosmochimica Acta
Patents
Top collaborators
OG
Oki Gunawan
Research Staff Member
NM
Nathan Marchack
Staff Research Scientist, Quantum and AI Hardware Research
GC
Guy Cohen
Research Staff Member
DD
Dan J. Dechene
Director, Semiconductor Enablement