Novel ellipsometry-based machine learning technique for characterization of low sensitivity critical dimensions within gate-all-around transistors
- Houssam Chouaib
- Valeria Dimastrodonato
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Mary is currently the manager of the GRV, Macro Design, & Infrastructure group, within the IBM Semiconductor Research & Development organization. The team focuses on semiconductor R&D for next generation technology.
Previously, Mary was the manager of the inline metrology group, which explores a variety of electron, optical, magnetic, scanning, and x-ray based techniques for dimensional and material measurements. In her first IBM fulltime role as a metrology engineer, she was heavily involved in inline CDSEM, AFM, and scatterometry projects.
Mary's Bachelor of Science degree (S.B.) is from Massachusetts Institute of Technology (MIT) from the Department of Materials Science and Engineering (DMSE). She received her Masters of Engineering (M.Eng) from Rensselaer Polytechnic Institute's (RPI's) Materials Science and Engineering (MSE) Department in 2017 and researched under Dr. Robert Hull. She was a summer metrology intern at IBM's East Fishkill site developing an algorithm to reduce model build time for scatterometry projects before joining IBM full-time.