About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
SPIE Advanced Lithography + Patterning 2024
Conference paper
Novel ellipsometry-based machine learning technique for characterization of low sensitivity critical dimensions within gate-all-around transistors
Abstract
We propose a versatile ellipsometry methodology that overcomes poor sensitivity and increases accuracy through a novel principal component approximation (PCA) method of the ML training algorithm with RCWA assistance. Furthermore, our methodology introduces a new ML training concept based on reference data statistics, rather than raw reference. The approach has been successfully employed to monitor sheet-specific indent within GAA architectures and was validated with reference data from cross-sectional transmission electron microscopy images. The proposed methodology paves the way to measuring low sensitivity CDs with highly accurate, noise-reduced and robust ML based physical OCD models for any logic and memory application.