Publications

28 results for D.D. Restaino

A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- - S. Sankaran
  - S. Arai
  - et al.
- 2006
- IEDM 2006
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
- - S. Narasimha
  - K. Onishi
  - et al.
- 2006
- IEDM 2006
65nm Cu integration and interconnect reliability in low stress K=2.75 SiCOH
- - V. McGahay
  - G. Bonilla
  - et al.
- 2006
- IITC 2006
Electromigration Cu mass flow in Cu interconnections
- - C.-K. Hu
  - D. Canaperi
  - et al.
- 2006
- Thin Solid Films
PECVD Low-k (∼2.7) dielectric SiCOH film development and integration for 65 nm CMOS devices
- - K. Ida
  - S. Nguyen
  - et al.
- 2005
- AMC 2005
Lower-k SiCOH integration for 65 nm ground rules
- - T. Nogami
  - S. Lane
  - et al.
- 2005
- VMIC 2005
Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes
- - T. Nogami
  - S. Lane
  - et al.
- 2005
- Optics East 2005
Channel cracking in low-k films on patterned multi-layers
- - X.-H. Liu
  - T.M. Shaw
  - et al.
- 2004
- IITC 2004
Optimization of SiCOH dielectrics for integration in a 90 nm CMOS technology
- - A. Grill
  - D. Edelstein
  - et al.
- 2004
- IITC 2004
Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
- - D. Edelstein
  - C.R. Davis
  - et al.
- 2004
- IITC 2004