Publications

18 results at ECTC 2008

Characterization of stacked die using die-to-wafer integration for high yield and throughput
- - K. Sakuma
  - P. Andry
  - et al.
- 2008
- ECTC 2008
The viability of 25 Gb/s on-board signalling
- - Mark B. Ritter
  - Petar Pepeljugoski
  - et al.
- 2008
- ECTC 2008
Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- - Minhua Lu
  - Paul Lauro
  - et al.
- 2008
- ECTC 2008
C4NP Cu-cored Pb-free flip chip interconnections
- - Jae-Woong Nah
  - Stephen L. Buchwalter
  - et al.
- 2008
- ECTC 2008
3D silicon integration
- - J. Knickerbocker
  - P. Andry
  - et al.
- 2008
- ECTC 2008
Underfill fracture toughness as a function of cooling rate
- - Soojae Park
  - Claudius Feger
- 2008
- ECTC 2008
High-density optical interconnect exploiting build-up waveguide-on-SLC board
- - Shigeru Nakagawa
  - Yoichi Taira
  - et al.
- 2008
- ECTC 2008
Chip package interaction evaluation for a high performance 65nm and 45nm CMOS technology in a stacked die package with C4 and wirebond interconnections
- - Christopher Muzzy
  - David Danovitch
  - et al.
- 2008
- ECTC 2008