High-density optical interconnect exploiting build-up waveguide-on-SLC board

Abstract

More optical channels have been implemented into computing systems as the system performance keeps increasing. Optical interconnects bring advantage of high data rate density, i.e. large bandwidth with small physical dimensions, as well as large bandwidth x distance product. High data rate density enables tight integration of many optical channels with electronic chips. One technique to implement such high density benefit is a printed circuit board (PCB) integrated with optical waveguides. In this paper, we will present an optical interconnect employing a waveguide-integrated surface laminar circuit (SLC) board. A build-up waveguide layer is formed on a SLC by laminating polymer films. Both optical and electronic chips are flip-chip mounted on the board. Optical signals are coupled with the waveguides by a 45-degree mirror formed on the waveguide. Electrical connections between the chips and the SLC circuits are provided by electrical vias through the waveguide layer. 10Gbps operation has been demonstrated by a vertical-cavity surface-emitting laser (VCSEL) mounted on the waveguide-on-SLC board. © 2008 IEEE.