Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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48 results for Arvind Kumar

Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- - Aakrati Jain
  - Risa Miyazawa
  - et al.
- 2023
- ECTC 2023
Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- - Ram Krishna
  - Atom O. Watanabe
  - et al.
- 2023
- ECTC 2023
Challenges and solutions of FinFET integration in an SRAM cell and a logic circuit for 22 nm node and beyond
- - H. Kawasaki
  - V.S. Basker
  - et al.
- 2009
- IEDM 2009
22 nm technology compatible fully functional 0.1 μm ² 6T-sram cell
- - B. Haran
  - A. Kumar
  - et al.
- 2008
- IEDM 2008
Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- - A. Topol
  - D.C. La Tulipe
  - et al.
- 2005
- IEDM 2005
Performance comparison and channel length scaling of strained Si FETs on SiGe-on-insulator (SGOI)
- - J. Cai
  - K. Rim
  - et al.
- 2004
- IEDM 2004
Simulation of quantum electronic transport in small devices: A Master equation approach
- - M.V. Fischetti
  - S.E. Laux
  - et al.
- 2003
- IEDM 2003
QDAME simulation of 7.5 nm double-gate Si nFETs with differing access geometries
- - S.E. Laux
  - A. Kumar
  - et al.
- 2002
- IEDM 2002
Gate length and performance scaling of undoped-body extremely thin SOI MOSFETs
- - Amlan Majumdar
  - Xinlin Wang
  - et al.
- 2009
- IEEE Electron Device Letters
Strained-Si channel super-self-aligned back-gate/double-gate planar transistors
- - Hao Lin
  - Haitao Liu
  - et al.
- 2007
- IEEE Electron Device Letters