Accelerating High NA EUV Lithography Insertion for Interconnect Scaling and Beyond: Performance, Cost, and Future Prospects
- Luciana Meli
- Indira Seshadri
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
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4 results for Chris Penny
Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- Koichi Motoyama
- Jaemyung Choi
- et al.
- 2024
- IEDM 2024
EUV Double Patterning Solution for Subtractive Metal Patterning at 18nm Pitch
- Chris Penny
- Koichi Motoyama
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Challenges and Innovations For Advanced BEOL Scaling at the 1nm Node and Beyond
- Chris Penny
- 2023
- VLSI Technology 2023