Publication
EDAPS 2022
Conference paper

Thermal solution for Co-Packaged Optics (CPO) modules

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Abstract

In Co-Packaged Optics (CPO) where optical devices and ICs are attached to a common base substrate, there are requirements to keep the temperature of high-heat-dissipating ICs as low as possible and also to keep the temperature of optical devices constant. We propose two solutions to meet these two requirements and show the effect of two solutions by simulation.

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Publication

EDAPS 2022

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