M. Hargrove, S.W. Crowder, et al.
IEDM 1998
The initial stage of the thermal oxidation of various crystallographic orientations of silicon ((100), (110), and (111) orientations) reveals a complex rate behavior. This behavior is not understood within the conventional linear-parabolic model. A recently revised model which explicitly contains the areal density of Si atoms and mechanical stress effects is shown to provide both a qualitative (for all orientations studied) and somewhat quantitative (for (110) and (111) orientations) explanation of the complex substrate orientation effects. © 1986, The Electrochemical Society, Inc. All rights reserved.
M. Hargrove, S.W. Crowder, et al.
IEDM 1998
O.F. Schirmer, K.W. Blazey, et al.
Physical Review B
J.K. Gimzewski, T.A. Jung, et al.
Surface Science
Kigook Song, Robert D. Miller, et al.
Macromolecules