Channel coding considerations for wireless LANs
Daniel J. Costello Jr., Pierre R. Chevillat, et al.
ISIT 1997
Self-assembling diblock copolymer thin films are an intriguing possible photolithography alternative for high-resolution patterning of advanced integrated circuit device elements. Cylindrical- and lamellar-phase materials spontaneously form patterns suggestive of contact-hole arrays and transistor gates at critical dimensions below 20nm. Besides high resolution, any serious lithographic process requires a means of pattern registration, and we discuss our efforts to develop self-aligned self assembly techniques using diblock copolymer materials. We describe the critical role of polymer surface interactions in affecting self-assembled pattern orientations. Control and design of surface properties allow precise registration of sub-20nm polymer domains to larger-scale lithographic layers.
Daniel J. Costello Jr., Pierre R. Chevillat, et al.
ISIT 1997
Naga Ayachitula, Melissa Buco, et al.
SCC 2007
Martin Charles Golumbic, Renu C. Laskar
Discrete Applied Mathematics
Robert F. Gordon, Edward A. MacNair, et al.
WSC 1985