Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumpsKatsuyuki SakumaGriselda Bonillaet al.2023ECTC 2023
RaPiD: AI Accelerator for Ultra-Low Precision Training and InferenceSwagath VenkataramaniVijayalakshmi Srinivasanet al.2021ISCA 2021
ScaleCom: Scalable Sparsified Gradient Compression for Communication-Efficient Distributed Training Chia-Yu ChenJiamin Niet al.2020NeurIPS 2020
AFM Assisted Hybrid Bonding Interface OptimizationNick PolomoffJennifer Fullamet al.2025SPIE Advanced Lithography + Patterning 2025
Multi-reticle stitching: Applications from packaging to High-NA EUVChris BottomsRick Johnsonet al.2025SPIE Advanced Lithography + Patterning 2025
IBM Telum II: Next Generation 5.5GHz Microprocessor with On-Die Data Processing Unit and Improved AI AcceleratorGerry StrevigChris Berryet al.2025ISSCC 2025