Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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16 results at IEEE Trans Electromagn Compat

Energy-Aware Signal Integrity Analysis for High-Speed PCB Links
- - Sebastian Müller
  - Torsten Reuschel
  - et al.
- 2015
- IEEE Trans Electromagn Compat
A rigorous approach for the radiated emission characterization based on the spherical magnetic field scanning
- - Ping Li
  - Li Jun Jiang
- 2014
- IEEE Trans Electromagn Compat
Partial and internal inductance: Two of Clayton R. Paul's many passions
- - Christopher L. Holloway
  - Edward F. Kuester
  - et al.
- 2013
- IEEE Trans Electromagn Compat
Accuracy of physics-based via models for simulation of dense via arrays
- - Sebastian Müller
  - Xiaomin Duan
  - et al.
- 2012
- IEEE Trans Electromagn Compat
Multipoint full-wave model order reduction for delayed PEEC models with large delays
- - Francesco Ferranti
  - Michel S. Nakhla
  - et al.
- 2011
- IEEE Trans Electromagn Compat
Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure
- - Jongjoo Shim
  - Dong Gun Kam
  - et al.
- 2010
- IEEE Trans Electromagn Compat
Application of the short-pulse propagation technique for broadband characterization of PCB and other interconnect technologies
- - Alina Deutsch
  - Roger S. Krabbenhoft
  - et al.
- 2010
- IEEE Trans Electromagn Compat
Fast EMI analysis via transverse partitioning and waveform relaxation
- - Arvind R. Sridhar
  - Natalie M. Nakhla
  - et al.
- 2009
- IEEE Trans Electromagn Compat
Impact of partial element accuracy on PEEC model stability
- - Jonas Ekman
  - Giulio Antonini
  - et al.
- 2006
- IEEE Trans Electromagn Compat
Nonorthogonal PEEC formulation for time- and frequency-domain EM and circuit modeling
- - Albert E. Ruehli
  - Giulio Antonini
  - et al.
- 2003
- IEEE Trans Electromagn Compat