J.R. Thompson, Yang Ren Sun, et al.
Physica A: Statistical Mechanics and its Applications
A comprehensive overview is given of the strengths, limitations, and applicability of the short-pulse propagation technique (SPP). SPP is shown to be able to extract the broadband characteristics of a wide range of interconnect technologies found in digital computer applications and generate causal predictive models. Examples are given of such applications from on-chip wiring, ceramic and organic chip carrier, cards, boards, to cables, and structures with large inhomogeneities, such as found in differential and microstrip cases, irregularities (such as introduced by roughening of metallization), and various operating conditions, such as variable temperature and humidity. The use of SPP as a virtual test bench is explained and showcased through the analysis of the impact of manufacturing tolerances and via stub length on the electrical characteristics. The diverse versatility of the SPP method is discussed through many examples on practical interconnect structures with special emphasis on printed circuit board wiring. © 2006 IEEE.
J.R. Thompson, Yang Ren Sun, et al.
Physica A: Statistical Mechanics and its Applications
A. Gupta, R. Gross, et al.
SPIE Advances in Semiconductors and Superconductors 1990
Michiel Sprik
Journal of Physics Condensed Matter
I.K. Pour, D.J. Krajnovich, et al.
SPIE Optical Materials for High Average Power Lasers 1992