Publications

17 results at ECTC 2014

Modeling of switching noise and coupling in multiple chips of 3D TSV-based systems
- - Huanyu He
  - Xiaoxiong Gu
  - et al.
- 2014
- ECTC 2014
A compact 4-chip package with 64 embedded dual-polarization antennas for W-band phased-array transceivers
- - Xiaoxiong Gu
  - Duixian Liu
  - et al.
- 2014
- ECTC 2014
Wafer-level non conductive films for exascale servers
- - Akihiro Horibe
  - Sayuri Kohara
  - et al.
- 2014
- ECTC 2014
Nanofiller based spin-on materials for negligible reflection of silicon photonic external coupling
- - Yoichi Taira
  - Ryuma Mizusawa
  - et al.
- 2014
- ECTC 2014
Multicore fiber 4 TX + 4 RX optical transceiver based on holey SiGe IC
- - Fuad E. Doany
  - Daniel M. Kuchta
  - et al.
- 2014
- ECTC 2014
Factors in the selection of temporary wafer handlers for 3D/2.5D integration
- - Bing Dang
  - Bucknell Webb
  - et al.
- 2014
- ECTC 2014
Advanced wafer bonding and laser debonding
- - Paul Andry
  - Russell A. Budd
  - et al.
- 2014
- ECTC 2014
Development of electroless nickel-iron plating process for microelectronic applications
- - Yu Luo
  - Sung K. Kang
  - et al.
- 2014
- ECTC 2014
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- - Bing Dang
  - Joana Maria
  - et al.
- 2014
- ECTC 2014
Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
- - Tymon Barwicz
  - Yoichi Taira
  - et al.
- 2014
- ECTC 2014