Publication
ECTC 2014
Conference paper

Factors in the selection of temporary wafer handlers for 3D/2.5D integration

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Abstract

This paper reviews the recent progress in temporary wafer handling technologies for 3D/2.5D wafer integration. Several critical factors in the selection of a temporary wafer handler technology for 3D/2.5D integration will be discussed and some recommendations are made.

Date

Publication

ECTC 2014

Authors

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