Proposal of Package Structure Requirements for Effective Cooling from the Bottom Side of Chips (from the Substrate Side), Aiming for a Three-Dimensional (3D) Chip Stack
- Keiji Matsumoto
- Hiroyuki Mori
- 2016
- ECTC 2016
Publications
790 results for Semiconductors
Detection of printable EUV mask absorber defects and defect adders by full chip optical inspection of EUV patterned wafers
- Luciana Meli
- Scott D. Halle
- et al.
- 2016
- ASMC 2016
Most Probable Paths to Data Loss: An Efficient Method for Reliability Evaluation of Data Storage Systems
- Ilias Iliadis
- Vinodh Venkatesan
- 2015
- International Journal on Advances in Systems and Measurements
Essential edge protection techniques for successful multi-wafer stacking
- Joshua Rubin
- Kevin Winstel
- et al.
- 2015
- S3S 2015
Warpage analysis of organic substrates for 2.1D packaging
- Sayuri Kohara
- Keishi Okamoto
- et al.
- 2015
- 3DIC 2015
TrueNorth: Design and Tool Flow of a 65 mW 1 Million Neuron Programmable Neurosynaptic Chip
- Filipp Akopyan
- Jun Sawada
- et al.
- 2015
- IEEE TCADIS
Advances in percolated thermal underfill (PTU) simulations for 3D-integration
- Sridhar Kumar
- Uwe Zschenderlein
- et al.
- 2015
- EuroSimE 2015
An Efficient Method for Reliability Evaluation of Data Storage Systems
- Ilias Iliadis
- Vinodh Venkatesan
- 2015
- CTRQ 2015
Stream as you go: The case for incremental data access and processing in the cloud
- Romeo Kienzler
- Rémy Bruggmann
- et al.
- 2012
- ICDE 2012
Improving server utilization using fast virtual machine migration
- Canturk Isci
- Jiuxing Liu
- et al.
- 2011
- IBM J. Res. Dev