Publications

509 results at JES

On the Pitting Resistance of Sputter-Deposited Aluminum Alloys
- - R.C. Newman
  - C.V. Jahnes
  - et al.
- 1993
- JES
Fabrication of Tungsten Local Interconnect for VLSI Bipolar Technology
- - N.J. Mazzeo
  - J.D. Warnock
  - et al.
- 1993
- JES
In Situ Surface Exafs Study of an Underpotentially Deposited Silver Monolayer on Gold (111)
- - Mahesh G. Samant
  - Gary Borges
  - et al.
- 1993
- JES
Growth Rate Enhancement of Heavy n- and P-Type Doped Silicon Deposited by Atmospheric-Pressure Chemical Vapor Deposition at Low Temperatures
- - P. Agnello
  - T.O. Sedgwick
  - et al.
- 1993
- JES
Chemical Vapor Deposited Copper from Alkyne Stabilized Copper (I) Hexafluoroacetylacetonate Complexes
- - Thomas H. Baum
  - Carl E. Larson
- 1993
- JES
Corrosion Inhibition of Cobalt with a Thin Film of Cu-BTA
- - B.M. Rush
  - G.S. Frankel
  - et al.
- 1993
- JES
Conditions for an Oxide-Free Si Surface for Low-Temperature Processing: Steady-State Boundary
- - P. Agnello
  - T.O. Sedgwick
- 1992
- JES
Some Factors Affecting Hillock Formation due to PECVD Processing of Sputtered Al-4% Cu-1% Si Films
- - V.J. Minkiewicz
  - J.O. Moore
  - et al.
- 1992
- JES
The Influence of Lithographic Patterning on Current Distribution: A Model for Microfabrication by Electrodeposition
- - H.Y. Cheh
  - J. Dukovic
  - et al.
- 1992
- JES
New High-Resolution and High-Sensitivity Deep UV, X-Ray, and Electron-Beam Resists
- - M. Hatzakis
  - K.J. Stewart
  - et al.
- 1991
- JES