Publications

Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
- - Jae-Woong Nah
  - Michael A. Gaynes
  - et al.
- 2011
- ECTC 2011
High performance wafer level underfill material with high filler loading
- - Satoru Katsurayama
  - Hiroshi Suzuki
  - et al.
- 2011
- ECTC 2011
Blending freeform and managed information in tables (NIER track)
- - Nicolas Mangano
  - Harold Ossher
  - et al.
- 2011
- ICSE 2011
Refactoring Java programs for flexible locking
- - Max Schäfer
  - Manu Sridharan
  - et al.
- 2011
- ICSE 2011
Code coverage analysis in practice for large systems
- - Yoram Adler
  - Noam Behar
  - et al.
- 2011
- ICSE 2011
Using MATCON to generate CASE tools that guide deployment of pre-packaged applications
- - Elad Fein
  - Natalia Razinkov
  - et al.
- 2011
- ICSE 2011
Workshop on Cooperative and Human Aspects of Software Engineering (CHASE 2011)
- - Marcelo Cataldo
  - Cleidson De Souza
  - et al.
- 2011
- ICSE 2011
Angelic debugging
- - Satish Chandra
  - Emina Torlak
  - et al.
- 2011
- ICSE 2011
Workshop on flexible modeling tools (FlexiTools 2011)
- - Harold Ossher
  - André Van Der Hoek
  - et al.
- 2011
- ICSE 2011
Deploying CogTool: Integrating quantitative usability assessment into real-world software development
- - Rachel Bellamy
  - Bonnie John
  - et al.
- 2011
- ICSE 2011