Optimization of Electrodeposit Uniformity by the Use of Auxiliary Electrodes
- S. Mehdizadeh
- J. Dukovic
- et al.
- 2019
- JES
Publications
509 results at JES
MnFe and NiFe Thin Films and Magnetic Exchange Bilayers
- Michael A. Russak
- S.M. Rossnagel
- et al.
- 2019
- JES
Electrical Properties of AI/Ti Contact Metallurgy for VLSI Applications
- C.-Y. Ting
- B.L. Crowder
- 2019
- JES
Selective dry etching of germanium with respect to silicon and vice versa
- G.S. Oehrlein
- T.D. Bestwick
- et al.
- 2019
- JES
On the Temperature Dependence of Majority Carrier Transport in Heavily Arsenic-Doped Polycrystalline Silicon Thin Films
- John D. Cressler
- Wei Hwang
- et al.
- 2019
- JES
Initiation of electroless copper plating using Pd+2/poly(acrylic acid) films
- Robert L. Jackson
- 2019
- JES
Corrosion Processes in Magneto-optic Films
- M.M. Farrow
- E.E. Marinero
- 2019
- JES
Conducting Transition Metal Oxides: Possibilities for RuO2in VLSI Metallization
- L. Krusin-Elbaum
- M. Wittmer
- 2019
- JES
Low Energy Proton Beam Lithography with a Thin Oxygen-Etch Barrier Layer
- H. Hiraoka
- 2019
- JES
Composition Determination of Electrodeposited NiSn and PbSn Alloys Using Stripping Voltammetry at a Rotating Ring-Disk Electrode
- K.H. Wong
- P.C. Andricacos
- 2019
- JES