Publications

23 results at ECTC 2023

Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- - Shrivani Pandiya
  - Serge Ecoffey
  - et al.
- 2023
- ECTC 2023
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- - Juliano Borges
  - Maxime Darnon
  - et al.
- 2023
- ECTC 2023
1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- - Hussein Hamieh
  - Juliano Borges
  - et al.
- 2023
- ECTC 2023
High Density Photonic Reservoir Computing using Optical Fiber and Polymer Waveguide
- - Hidetoshi Numata
  - Toshiyuki Yamane
  - et al.
- 2023
- ECTC 2023
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- - Duixian Liu
  - Xiaoxiong Gu
  - et al.
- 2023
- ECTC 2023
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- - Prabudhya Roy Chowdhury
  - Sathya Raghavan
  - et al.
- 2023
- ECTC 2023
Experimental Identification of the Failure Modes and Failure Mechanisms of Fiber to Waveguide Couplings Under Cyclic Tensile Loading
- - Assane Dione
  - Jean-Francois Morissette
  - et al.
- 2023
- ECTC 2023
Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
- - Hafiz Wakas Ali
  - David Danovitch
  - et al.
- 2023
- ECTC 2023
Module, antenna, and package design considerations for mm-scale IoT devices
- - Arun Paidimarri
  - Duixian Liu
  - et al.
- 2023
- ECTC 2023
Extracting Anisotropic Permittivity of PCB Substrate from VNA Measurement on a Rectangular Stripline Resonator Loaded with a Via Array
- - Zhaoqing Chen
  - Hung Nguyen
  - et al.
- 2023
- ECTC 2023