Thermal characterization of percolating thermal underfills: Bulk and cavity
- Brian R. Burg
- Manuel Koilly
- et al.
- 2014
- THERMINIC 2014
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154 results for Thomas Brunschwiler
Characterization of particle beds in percolating thermal underfills based on centrifugation
- Severin Zimmermann
- Thomas Brunschwiler
- et al.
- 2014
- 3DIC 2014
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Concept
- Thomas Brunschwiler
- Ralph Heller
- et al.
- 2014
- ESTC 2014
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation
- Thomas Brunschwiler
- Timo Tick
- et al.
- 2014
- ESTC 2014
Wafer-level integration of embedded cooling approaches
- Stephan Paredes
- Yassir Madhour
- et al.
- 2014
- ISSWB 2014
Study of the compound of properties of percolating and neck-based thermal underfills
- Thomas Brunschwiler
- Florian Schindler-Saefkow
- et al.
- 2014
- ITherm 2014
Thermo-mechanical properties of underfills at partial and full filler percolation - Sub-layering the underfill
- Gerd Schlottig
- Marie Haupt
- et al.
- 2014
- EuroSimE 2014
Laminate with thermal - Power insert for efficient front-side heat removal and power delivery
- Dominic Gschwend
- Timo Tick
- et al.
- 2014
- CIPS 2014
Integration of intra chip stack fluidic cooling using thin-layer solder bonding
- Yassir Madhour
- Michael Zervas
- et al.
- 2013
- 3DIC 2013
STEAM: A fast compact thermal model for two-phase cooling of integrated circuits
- Arvind Sridhar
- Yassir Madhour
- et al.
- 2013
- ICCAD 2013