Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- SEMI-THERM 2017
Publications
155 results for Thomas Brunschwiler
Relief printing of micron-sized electrical conductive structures on silicon
- S. Gerke
- Jonas Zürcher
- et al.
- 2017
- Flexible and Printed Electronics
Scalable packaging platform supporting high-performance 3D chip stacks
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2017
- Pan Pacific 2017
Enhanced percolating thermal underfills achieved by means of nanoparticle bridging necks
- Jonas Zürcher
- Xi Chen
- et al.
- 2016
- IEEE Transactions on CPMT
Intra-stack sealing of tier interconnects using the interconnect alloy
- Jessica Kleff
- Gerd Schlottig
- et al.
- 2016
- ESTC 2016
Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels
- Thomas Brunschwiler
- Raúl Mroßko
- et al.
- 2016
- ESTC 2016
Exploration of inductor-based hybrid integrated voltage regulator architectures
- Arvind Sridhar
- Thomas Brunschwiler
- et al.
- 2016
- ESTC 2016
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging
Control and Implementation Aspects of a Multiphase Inductor-Based FIVR in 14 nm Bulk CMOS for Microprocessor Applications
- Riduan K. Aljameh
- Pedro A. M. Bezerra
- et al.
- 2016
- PwSoC 2016
All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- Jonas Zürcher
- Luca Del Carro
- et al.
- 2016
- ECTC 2016