Performance and reliability of airgaps for advanced BEOL Interconnects
- S.V. Nitta
- D. Edelstein
- et al.
- 2008
- IITC 2008
Publications
146 results for Daniel Edelstein
Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps
- A. Grill
- D. Edelstein
- et al.
- 2008
- Journal of Applied Physics
Enhanced cracking resistance of plasma deposited low k SiCOH films with nano imbedded layers
- Son Nguyen
- Eric Liniger
- et al.
- 2007
- ECS Meeting 2007
Advanced Cu/low-k BEOL integration, reliability, and extendibility
- Daniel C. Edelstein
- 2007
- IITC 2007
Optimization of silicon technology for the IBM System z9
- Daniel J. Poindexter
- Scott R. Stiffler
- et al.
- 2007
- IBM J. Res. Dev
A porous SiCOH dielectric with k=2.4 for high performance BEOL interconnects
- S. Gates
- A. Grill
- et al.
- 2006
- ADMETA 2006
Non-poisoning dual damascene patterning scheme for low-k and ultra low-k BEOL
- W. Cote
- D. Edelstein
- et al.
- 2006
- ADMETA 2006
Physical, electrical, and reliability characterization of Ru for Cu interconnects
- C.-C. Yang
- T. Spooner
- et al.
- 2006
- IITC 2006
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- S. Sankaran
- S. Arai
- et al.
- 2006
- IEDM 2006
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
- S. Narasimha
- K. Onishi
- et al.
- 2006
- IEDM 2006