Publications

11 results for Chinami Marushima

Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- - Akihiro Horibe
  - Takahito Watanabe
  - et al.
- 2024
- ECTC 2024
Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- - Akihiro Horibe
  - Chinami Marushima
  - et al.
- 2022
- ECTC 2022
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- - Chinami Marushima
  - Toyohiro Aoki
  - et al.
- 2022
- ECTC 2022
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- - Akihiro Horibe
  - Takahito Watanabe
  - et al.
- 2022
- ECTC 2022
Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
- - Sayuri Kohara
  - Toyohiro Aoki
  - et al.
- 2022
- ITherm 2022
Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar
- - Takashi Hisada
  - Sayuri Kohara
  - et al.
- 2022
- ICEP 2022
Surface Silicon Bridge Direct Bonded Heterogeneous Integration (s-DBHi)
- - Kamal Sikka
  - Isabel De Sousa
  - et al.
- 2022
- EDTM 2022
Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process
- - Chinami Marushima
  - Toyohiro Aoki
  - et al.
- 2021
- ICEP 2021
Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability
- - Risa Miyazawa
  - Eiji Nakamura
  - et al.
- 2021
- Advancing Microelectronics
Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology
- - Eiji Nakamura
  - Toyohiro Aoki
  - et al.
- 2021
- Advancing Microelectronics