Multi-reticle stitching: Applications from packaging to High-NA EUVChris BottomsRick Johnsonet al.2025SPIE Advanced Lithography + Patterning 2025
Accelerating High NA EUV Lithography Insertion for Interconnect Scaling and Beyond: Performance, Cost, and Future ProspectsLuciana MeliIndira Seshadriet al.2025SPIE Advanced Lithography + Patterning 2025