Use of high temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface modified by an ac nitrogen glow discharge
- J.B. Ma
- J. Dragon
- et al.
- 1995
- Journal of Adhesion Science and Technology
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.