Revanth Kodoru, Atanu Saha, et al.
arXiv
We have used an extreme environmental stress test to study the adhesion of a thin sputtered copper film (0.5 μm) to flexible polyimide (PI) substrates between 25 and 125 μm thick. The polyimide types include Kapton (PMDA-ODA) and Upilex (BPDA-PDA). When there was no surface modification on the PI, the adhesion of the film to Upilex type S was better than the adhesion to Upilex type R or Kapton type HN. When the polymer surface was treated with a simple AC nitrogen glow discharge (NGD), there was an improvement in the adhesion of the film to each of these polyimides. This improvement in adhesion became apparent after the film/substrate combination was subjected to either boiling water or steam for 30 min or more; the difference became quite clear after 2 h. A simple tape test was used to quickly estimate a relative adhesion strength. In order to compare the effect of our AC NGD treatment with other substrate surface modification methods, we used it to improve the coupling of a thick (> 10 μim) layer of copper (via a thin intermediate chromium layer) to a rigid PI substrate, formed from spin coating its precursor onto a silicon wafer. Peel test results were within a factor of 2-3 of the corresponding results obtained with a radio frequency (RF) plasma and ion beam treatments. © VSP.
Revanth Kodoru, Atanu Saha, et al.
arXiv
Douglass S. Kalika, David W. Giles, et al.
Journal of Rheology
Eloisa Bentivegna
Big Data 2022
Shiyi Chen, Daniel Martínez, et al.
Physics of Fluids