Organosilicon polymers for lithographic applications
- J.M. Shaw
- M. Hatzakis
- et al.
- 2004
- Polymer Engineering & Science
Publications
36 results for Jurij Paraszczak
Poly(4‐chlorostyrene), a new high contrast negative E‐beam resist
- J. Liutkus
- M. Hatzakis
- et al.
- 2004
- Polymer Engineering & Science
In‐plane solvent diffusion in a photosensitive polyimide
- Da‐Yuan Shih
- Sharon Nunes
- et al.
- 2003
- Journal of Applied Polymer Science
Diamondlike carbon materials as low-k dielectrics for multilevel interconnects in ULSI
- A. Grill
- V.V. Patel
- et al.
- 1996
- MRS Fall Meeting 1996
Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
High performance dielectrics and processes for ULSI interconnection technologies
- J. Paraszczak
- D. Edelstein
- et al.
- 1993
- IEDM 1993
Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
An isotope approach to characterization of microwave water plasma modified polyimide surfaces
- N.J. Chou
- A.D. Marwick
- et al.
- 1992
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Thin-film interdiffusions in Cu/Pd, Cu/Pt, Cu/Ni, Cu/NiB, Cu/Co, Cu/Cr, Cu/Ti, and Cu/TiN bilayer films: Correlations of sheet resistance with Rutherford backscattering spectrometries
- D.Y. Shih
- C.A. Chang
- et al.
- 1991
- Journal of Applied Physics
Cu passivation: A method of inhibiting copper-polyamic acid interactions
- D.Y. Shih
- J. Kim
- et al.
- 1991
- Applied Physics Letters