Adhesion test standardization for multichip module packages

Abstract

The adhesion test standard and technique developed collectively by groups from the IBM Research Division, Yorktown Heights, and the Development Laboratory of IBM Microelectronics Division at East Fishkill are summarized. During the course of product development cycles, sample preparation and measurement techniques were found to strongly affect the measured adhesion strength of a multi-component structures. As a result, it was decided that standardization of the sample preparation and adhesion measurement techniques was required. The peel standard and the rules that form the basis for this standard are discussed.