Surface-topography simulations of ionized sputter metal deposition

Abstract

Numerical simulations are used to predict microscopic topography of deposited metal films in ionized magnetron sputter deposition experiments. The simulation takes into account ionized and neutral fluxes as deposition material sources and re-sputtering and re-deposition of the deposited material due to the ion bombardment. The shock-tracking algorithm is used to advance the moving surface boundary. Applications of this deposition technique include lining and filling of trenches, vias and dual damascene.