Publication
ECTC 2014
Conference paper

Preparing 25Gbps electrical I/O for exascale computing systems

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Abstract

This paper summarizes the exploratory work conducted at IBM Research and Zeon Corporation, which seeks to expand bandwidth and reduce power consumption of electrical I/O's for future exascale computing systems. The development of novel low-loss dielectric materials was coupled with highspeed and power scalable circuit designs to achieve 25Gbps per channel data-rate and to investigate power limits as low as 1pJ/bit at 10Gbps for aggregated parallel links. Results from test vehicles confirmed over 20% reduction in channel loss at 20GHz when compared to currently leading commercial materials, which will permit the extension of electrical link performance to meet future system requirements.

Date

Publication

ECTC 2014