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Conference paper
Polymer self assembly in semiconductor microelectronics
Abstract
Integration of polymer self assembly with semiconductor processing enables sub-lithographic patterning of integrated circuit (IC) device elements and offers a non-traditional pathway to performance improvements [1]. We discuss target applications including surface-roughening for on-chip decoupling capacitors [2], patterning nanocrystal floating gates for FLASH devices [3], and defining FET channel arrays [4].