Junctionless tri-gate InGaAs MOSFETs

Abstract

We demonstrate and characterize junctionless tri-gate InGaAs MOSFETs, fabricated using a simplified process with gate lengths down to L g = 25 nm at a nanowire dimension of 7 - 16 nm2. These devices use a single 7-nm-thick In0.80Ga0.20As (N D = 1 - 1019 cm-3) layer as both channel and contacts. The devices show SSsat = 76 mV/dec, peak g m = 1.6 mSm and I ON = 160A/m (at I OFF = 100 nA/m and V DD = 0.5 V), the latter which is the highest reported value for a junctionless FET. We also show that device performance is mainly limited by high parasitic access resistance due to the narrow and thin contact layer.