Conference paper
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
On-chip interconnects are fundamental to semiconductor functionality. We discuss the scaling challenges and opportunities to continue to offer increased system performance, especially as computing systems become heterogeneous. Continued focus must shift from traditional scaling and device performance towards providing the high interconnectivity needed to support heterogeneous systems.
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
Kohei Miyaguchi, Masao Joko, et al.
ASMC 2025
Victor Chan, A. Gasasira, et al.
IEEE Trans Semicond Manuf
Eric A. Joseph
AVS 2023