J. Heidenreich, J. Paraszczak, et al.
Microelectronic Engineering
The effect of the plasma stimulating frequency upon the etching of polyimide is reported. For the first time, a system has been developed which generates, over a large frequency domain (27-2450 MHz), a high-frequency (HF) produced plasma by identical means (surface wave propagation) in a fixed plasma volume. It is found that the addition of CF4 to an O2 plasma affects the etch rate of polyimide in a manner which depends upon the operating frequency of the HF plasma. In particular, a maximum of etch rate per watt is observed around 50 MHz.
J. Heidenreich, J. Paraszczak, et al.
Microelectronic Engineering
J. Paraszczak, E. Babich, et al.
Proceedings of SPIE 1989
E. Babich, J. Paraszczak, et al.
Microelectronic Engineering
D.Y. Shih, J. Kim, et al.
ECTC 1995