Conference paper
True 3-D displays for avionics and mission crewstations
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
A cost effective 28 nm CMOS Interconnect technology is presented for 28 nm node high performance and low power applications. Full entitlement of ultra low-k (ULK) inter-level dielectric is enabled. Copper wiring levels can be combined up to a total of 11 levels. The inter-level dielectric was optimized for low k-value and high strength. The feature profiles were optimized to enable defect-free metallization using conventional tools and processes. High yields and robust reliability were demonstrated. © 2011 Elsevier B.V. All rights reserved.
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
Shu-Jen Han, Dharmendar Reddy, et al.
ACS Nano
Hiroshi Ito, Reinhold Schwalm
JES
L.K. Wang, A. Acovic, et al.
MRS Spring Meeting 1993