CMOS-compatible wafer-level microdevice-distribution technology

Abstract

We present a novel cost-efficient heterogeneous device integration method based on the distribution principle. This robust, CMOS back end of the line (BEOL) compatible, wafer-scale device-selective transfer method for the batch fabrication of Systems-On-Chip is especially suitable for MEMS and ICs. The strategy for device selectivity during bonding and debonding is presented, and the demonstration of the technology is accomplished using AFM cantilevers as test vehicle. We have successfully selected a fraction of AFM devices from a single high-device-density "source" wafer and distributed them to populate many lower-device-density "receiver" wafers. ©2007 IEEE.