Evan G. Colgan, Bruce Furman, et al.
HVAC and R Research
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35 kPa. Further, cooling of a thermal test chip with a micro channel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300 W/cm2. Coolers of this design should be able to cool chips with average power densities of 400 W/cm2 or more. © 2007 IEEE.
Evan G. Colgan, Bruce Furman, et al.
HVAC and R Research
Steven A. Rosenau, Jonathan Simon, et al.
OFC 2006
Lei Shan, Young Kwark, et al.
ECTC 2015
Mark D. Schultz, Michael Gaynes, et al.
ITherm 2018