Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Date
Featured collections
Popular topics
14 results at ASME Journal of Electronic Packaging
Embedded two-phase cooling of large three-dimensional compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2016
- ASME Journal of Electronic Packaging
Benchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2016
- ASME Journal of Electronic Packaging
Lid-integral cold-plate topology: Integration, performance, and reliability
- Gerd Schlottig
- Marco De Fazio
- et al.
- 2016
- ASME Journal of Electronic Packaging
Modeling of two-phase evaporative heat transfer in three-dimensional multicavity high performance microprocessor chip stacks
- Yassir Madhour
- Brian P. D'Entremont
- et al.
- 2014
- ASME Journal of Electronic Packaging
Multiple fan-heat sink cooling system with enhanced evaporator base: Design, modeling, and experiment
- Pablo D. Quinones
- Lawrence S. Mok
- 2009
- ASME Journal of Electronic Packaging
A graphite foams based vapor chamber for chip heat spreading
- Minhua Lu
- Larry Mok
- et al.
- 2005
- ASME Journal of Electronic Packaging
A global sensitivity approach for the dynamic response of printed wiring boards
- H. Jensen
- A.O. Cifuentes
- 1995
- ASME Journal of Electronic Packaging
Some modeling issues on the finite element computation of thermal stresses in metal lines
- Arturo O. Cifuentes
- Iqbal A. Shareef
- 1993
- ASME Journal of Electronic Packaging
Modeling thermal stresses in periodic structures: Some obserwations regarding the boundary conditions
- A.O. Cifuentes
- S. Stiffler
- 1992
- ASME Journal of Electronic Packaging