Publications

3 results at IMAPS 2013

Scaling challenges of semiconductor packaging in the era of big data
- - Yasumitsu Orii
  - Akihiro Horibe
  - et al.
- 2013
- IMAPS 2013
Heat sink induced thermo-mechanical joint strain in QFN devices
- - Gerard McVicker
  - Vijay Khanna
  - et al.
- 2013
- IMAPS 2013
High thermal conductive inter chip fill for 3D-IC through pre-applied joining process
- - Y. Kawase
  - M. Ikemoto
  - et al.
- 2013
- IMAPS 2013