Publications

2 results at LTB-3D 2014

Copper-to-dielectric heterogeneous bonding for 3D integration
- - Wei Lin
  - Juntao Li
  - et al.
- 2014
- LTB-3D 2014
Three dimensional dynamic random access memory
- - Toshiaki Kirihata
- 2014
- LTB-3D 2014