Publications

2 results at IMAPS 2014

Pre-applied inter chip fill for 3D-IC joining
- - Yasuhiro Kawase
  - Makoto Ikemoto
  - et al.
- 2014
- IMAPS 2014
IMS (injection molded solder) technology with liquid photoresist for ultra fine pitch bumping
- - Toyohiro Aoki
  - Kazushige Toriyama
  - et al.
- 2014
- IMAPS 2014