Fine pitch bumping and flip chip joining with Sn-BI based solders by injection molded solder technology
- Toyohiro Aoki
- Katsuhiro Yoshida
- et al.
- 2021
- ICEP 2021
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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2 results at ICEP 2021
Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2021
- ICEP 2021