Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- C. J. Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
Publications
Date
Featured collections
Popular topics
87 results for Hybrid Cloud HPC
Co-design in High-Performance Systems
- Jaime Moreno
- Sophia Wen
- 2021
- IEDM 2021
Capri: Achieving Predictable Performance in Cloud Spot Markets
- Bogdan Ghit
- Asser Tantawi
- 2021
- MASCOTS 2021
Energy Efficiency Boost in the AI-Infused POWER10 Processor
- Brian Thompto
- Dq Nguyen
- et al.
- 2021
- ISCA 2021
Towards a common environment for learning scheduling algorithms
- Renato Luiz Cunha
- Luiz Chaimowicz
- 2020
- MASCOTS 2020
Investigating Genome Analysis Pipeline Performance on GATK with Cloud Object Storage
- Tatsuhiro Chiba
- Takeshi Yoshimura
- 2020
- MASCOTS 2020
Migrating Genome Analysis Pipeline to Cloud: GATK Optimization with Cloud Object Storage
- 2020
- MASCOTS 2020
A cloud-migration feasibility advisor
- Shubhi Asthana
- Aly Megahed
- et al.
- 2020
- ICDCS 2020
The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- Daniel Edelstein
- Son Nguyen
- et al.
- 2024
- IEDM 2024
Hardware Based Performance Assessment of Vertical-Transport Nanosheet Technology
- Gen Tsutsui
- Seunghyun Song
- et al.
- 2022
- IEDM 2022